西安速佳電路板工藝技術參數
發布時間：2014-9-30 來源：西安速佳電子 點擊次數：7564
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項 目 |
技術指標 | ||
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ITEM |
TECHNICAL PARAMETER | ||
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層 數 Layers |
1-26(層)layers | ||
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最大加工面積
Max.Board Size |
單面/雙面 Single/Double-siand PCB |
450mmX600mm | |
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多層板 Multilayer PCB |
450mmX600mm | ||
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板厚（剛性）Rigid
Board Thickness |
噴錫/噴純錫工藝（Sn/Pb）/( Sn)HASL |
0.6-5.0 mm | |
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整板鍍金板/防氧化工藝Gold Finishing/OSP PCB |
0.3-5.0 mm | ||
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最小線寬 Min.Line Width |
0.1 mm | ||
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最小間距 Min.Space |
0.1 mm | ||
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最小通孔孔徑 Min.Trough Hole Size |
0.2 mm | ||
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最小埋孔孔徑 Min.Buried Hole Size |
0.2 mm | ||
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最小盲孔孔徑 Min.Blind Hole Size |
0.2 mm | ||
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孔壁銅厚 PTHWall Thickness |
>=0.018 mm | ||
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金屬化孔徑公差
PTH Hole Dia.Tolerance |
Φ<=0.8 mm |
+-0.05 mm | |
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Φ＞0.8 mm |
+-0.08 mm | ||
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非金屬化孔徑公差
NON PTH Hole Dia.Tolerance |
Φ<=4.0 mm |
+-0.05 mm | |
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Φ＞4.0mm |
+-0.10 mm | ||
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孔位公差Hile Pastition Deviation |
+-0.05 mm | ||
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外形尺寸公差Outiline Toleance |
+-0.10 mm | ||
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絕緣電阻Hole Position Deviation |
1012Ω（常態）Normal | ||
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孔電阻Through Hole Resistance |
＜300UΩ（常態）Normal | ||
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抗電強度Dielectric Strength |
＞1.3Kv/mm | ||
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耐電壓Voltage Breakdown |
1000VDC | ||
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抗剝強度Peel-off Strength |
>=0.87N/mm | ||
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阻焊劑硬度Solder Mask Abrastion |
>=6H | ||
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熱沖擊Thermal Stress |
288+-5 -01秒三次 | ||
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阻燃性Flammability |
UL94-0 | ||
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通斷測試電壓E-text Voltage |
100-300V | ||
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表面處理工藝
Surface Process Technologist |
噴錫（Sn/Pb）HASL | ||
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板面鍍金Gold Finishing | |||
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防氧化OSP | |||
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插頭鍍金Gold Finger Plating | |||
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噴純錫( Sn)HASL | |||
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